Originally posted by AMD Soldier: Please post if any of your heatsinks have ever fallen off by themselves. If not just, post nop, or something to that degree.
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[This message has been edited by RangerBFK (edited December 27, 2001).]
Originally posted by AMD Soldier: Please post if any of your heatsinks have ever fallen off by themselves. If not just, post nop, or something to that degree.
Nop, but one of the machines which I built up for a client did. Don't know if it was a defective socket, but the stock Intel cooler broke it clean in half, ripped a lot of it off the board. P3 700 killed at the same time. Whoever designed the PGA370 socket should be shot. It's way too fragile.
I did have one do something odd at work the other week. I can attest to the 370 PGA socket being weak as hell. I was building a rackmount server that called for a FC-PGA 1 GHz P3. I put the CPU in the socket on the SBC ( Single Board Computer, like a mobo for a passive backplane rack system ) and put the heat sink on. However, the CPU was a FC-PGA2, with the big heat spreader on top. Well...the Cooler Master HSF was for a plain FC-PGA chip. The extra height on the CPU forced the HSF up so hard it cracked the socket, and the core of the P3. I pulled the HSF off after I smelled smoke, and the CORE CAME OUT attached to the thermal paste. Intel ships both FC-PGA and FC-PGA2 P3's to us under the same part#, and we are having to check them all now.
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Originally posted by Wurm: Nop but I have broken a P III Socket 370 (MoM if you find the guy, give him some birdshot in the @ss from me too!) removing a stock Intel HSF from it
And I was being carefull too....
At least Intel has finally caught on, the latest P4 sockets look almost impossible to break. Never the less, I'm sure that the Intel fab tech who frequents HT forum knows who designed the PGA370 factor (can't remember the nick at present )...we can get his address and hunt him down.
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